Service Life Of Solar Panels

The service life of solar panels is determined by the materials of the panels, tempered glass, EVA, TPT, etc. Generally, the service life of solar panels made by manufacturers who use better materials can reach 25 years, but with the impact of the environment, the materials of solar panels will age over time. Generally, the power will be reduced by 30% after 20 years of use, and by 70% after 25 years of use.
Slicing, cleaning, preparation of suede, peripheral etching, removal of PN+junctions on the back, fabrication of upper and lower electrodes, fabrication of antireflection films, sintering, testing and grading are 10 steps.
Specific manufacturing process instructions for solar cells
(1) Slicing: Using multi wire cutting, the silicon rod is cut into square silicon wafers.
(2) Cleaning: Clean the silicon wafer using conventional cleaning methods, and then remove the damaged layer on the surface of the silicon wafer by 30-50 um using an acid (or alkali) solution.
(3) Preparation of a textured surface: Anisotropic etching of a silicon wafer with an alkali solution is used to prepare a textured surface on the surface of the silicon wafer.
(4) Phosphorus diffusion: Using a coating source (or a liquid source, or a solid phosphorus nitride sheet source) for diffusion, a PN+junction is formed, with a junction depth generally of 0.3 to 0.5 um.
(5) Peripheral etching: The diffusion layer formed on the peripheral surface of the silicon wafer during diffusion can short-circuit the upper and lower electrodes of the battery, and the peripheral diffusion layer can be removed by masking wet etching or plasma dry etching.
(6) Remove the back PN+knot. Wet etching or grinding is commonly used to remove the PN+junction on the back.
(7) Fabrication of upper and lower electrodes: Using vacuum evaporation plating, electroless nickel plating, or aluminum paste printing and sintering processes. First, make the lower electrode, and then make the upper electrode. Aluminum paste printing is a widely used process method.
(8) Making antireflection films: To reduce the loss of incoming reflection, a layer of antireflection film should be covered on the surface of the silicon wafer. The materials used to produce antireflection films include MgF2, SiO2, Al2O3, SiO, Si3N4, TiO2, Ta2O5, etc. The process method can be vacuum coating method, ion coating method, sputtering method, printing method, PECVD method, or spraying method.
(9) Sintering: Sintering a battery chip onto a nickel or copper substrate.
(10) Test classification: According to the specified parameter specifications, test classification.